Thermal conductive gel
Features the product application
Heat transfer coefficient: 7.0/3.0/5.0, power module
, no settlement, room temperature storage, integrated chip
High and low temperature resistance, excellent, excellent resistance to climate,, power supply module
, radiation resistance and excellent dielectric properties, automotive electronic products
﹒ superior chemical and mechanical stability, controller
Stress, low modulus, low thermal conductivity products, telecommunications equipment
Else has the same plasticity and silly putty, easy to cooperate
Product design, requirements for thickness change is big
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Property
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2300
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2500
|
2700
|
TEST
METHOD
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UNIT
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The density of
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1.0
|
2.0
|
3.0
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ASTM D792
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---
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COLOR
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gray
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gray
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pink
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---
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Visual
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Coefficient of thermal conductivity
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3.0
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5.0
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7.0
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ASTM D5470
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W/mK
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Thermal impedance
|
0.004
|
0.003
|
0.001
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ASTM D5470
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C-In2/W
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