Thermal conductive silicone (thermal conductive paste)
Features the product application
Heat transfer coefficient: 1.0/2.0/3.0/5.0. CPU and chip cooler
. Low thermal resistance. Switching power supply
. Home appliances
The LED industry
|
Property
|
G100
|
G200
|
G300
|
G500
|
TEST METHOD
T
|
UNIT
|
|
The density of
|
2.1
|
2.3
|
2.7
|
3.2
|
ASTM D792
|
---
|
|
color
|
white
|
gray
|
gray
|
gray
|
---
|
Visual
|
|
vocs
|
0.6
|
0.5
|
0.3
|
0.2
|
ASTM E595
|
%/Wt
|
|
Coefficient of thermal conductivity
|
1.0
|
2.0
|
3.0
|
5.0
|
ASTM D5470
|
W/mK
|
|
Thermal impedance
|
0.052
|
0.041
|
0.025
|
0.009
|
ASTM D5470
|
C-In2/W
|
|
Withstand voltage
|
1300
|
1100
|
1000
|
600
|
ASTM D149
|
VAC/mil
|
|
Dielectric constant
|
4.3
|
4.5
|
4.7
|
4.8
|
ASTM D150
|
---
|
|
The volume resistance
|
>1013
|
>1013
|
>1013
|
>1012
|
ASTM D257
|
---
|
|
Working temperature
|
-50℃ to 200℃
|
