2100 is a 6.5 W/m.K of high thermal conductivity of a two-component epoxy functional thermal conductive adhesive glue, high thermal efficiency and bonding strength.Widely used in LED, photovoltaic, semiconductor and performance requirement of thermal conductivity of high module and other electronic products
2.Product features
1. Copper powder as the carrier of thermal conductivity, high stability matrix, and the thermal cycle under the conditions of use for a long time.
2. High bonding strength, especially suitable for aluminium, copper, nickel, ceramic, silver glue) between different materials, such as
3. High stability matrix, and the thermal cycle under the conditions of use for a long time.
4. Put fewer calories, curing shrinkage rate is low, meet the technological requirements of precision device.
5. Has excellent water resistance and acid and alkali.
6. High electromagnetic compatibility, improve the level of product safety, solvent free epoxy system, no volatile, comply with the eu environmental protection certification standards (RoHS, REACH, IATA).
7. At room temperature or low temperature heat curing, make circuit from the attenuation caused by high temperature influence performance in the process of production.
8. The use of low cost, cost-effective use of low cost, high cost performance.
9. Easy to operate high applicability, suitable for automatic dispensing daub,
