Product Description

2670 is a two-component retrofit of low-temperature curing epoxy resin sealing adhesive glue, has excellent high and low temperature impact resistance (to 40 ° C - + 160 ° C loop 200 times), good dielectric properties, weatherability, meet UL94V0 flame retardant standards, widely used in automotive electronics, new energy, sensors, such as environmental protection requirements of the product components of sealing and bonding.