Product Description

2800 is a high thermal conductivity with 2.7 W one-component epoxy system of thermal conductive adhesive glue,Using epoxy resin and curing agent of chemical reactions, the realization of different materials
Material between the curing adhesive, colloid to add a large amount of thermal conductive particles,
With high thermal conductivity and low heat capacity.
Widely used in the concentrator photovoltaic, LED, mill and other thermal conductivity and adhesive product high reliability requirements


Product features
1) high thermal conductive performance attenuation slow, low thermal capacity
(2) the high bonding strength, suitable for different materials, the bonding between simplifying product structure design
3. Low temperature curing, avoid in the process of the production and use of thermal damage to sensitive components
(4) after curing for insulation materials, improve product safety level
(5) operation for cream, suitable for automatic dispensing glue, also can be manual or stencil printing
 

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