G500高導熱硅脂
產品描述
Thermal conductive silicone (thermal conductive paste)
Features the product application
Heat transfer coefficient: 1.0/2.0/3.0/5.0. CPU and chip cooler
. Low thermal resistance. Switching power supply
. Home appliances
The LED industry
|
Property
|
G100 |
G200 |
G300 |
G500 |
TEST METHOD T |
UNIT
|
|
The density of |
2.1 |
2.3 |
2.7 |
3.2 |
ASTM D792 |
--- |
|
color |
white |
gray |
gray |
gray |
--- |
Visual |
|
vocs |
0.6 |
0.5 |
0.3 |
0.2 |
ASTM E595 |
%/Wt |
|
Coefficient of thermal conductivity |
1.0 |
2.0 |
3.0 |
5.0 |
ASTM D5470 |
W/mK |
|
Thermal impedance |
0.052 |
0.041 |
0.025 |
0.009 |
ASTM D5470 |
C-In2/W |
|
Withstand voltage |
1300 |
1100 |
1000 |
600 |
ASTM D149 |
VAC/mil |
|
Dielectric constant |
4.3 |
4.5 |
4.7 |
4.8 |
ASTM D150 |
--- |
|
The volume resistance |
>1013 |
>1013 |
>1013 |
>1012 |
ASTM D257 |
--- |
|
Working temperature |
-50℃ to 200℃ |
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產品圖片
